Suitable for use on vertical surfaces as it will not drip or slump.
Particularly suited to bonding difficult substrates which have a porous or uneven nature since it increases bonding strength by preventing the adhesive to be absorbed by the surface.
Suitable for MDF, wood, chip wood, rubber, most plastics, leather and other common substrates.
Especially suitable for the applications where cure speed needs to be accelerated.
Although Akfix 705 has a degree of gap filling ability, it is generally recommended for use on close-fitting parts and fairly smooth, even surfaces.
Colour clear
Application Temperature: 5°C to 35°C (41°F to 95°F)